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Maskless exposure equipment(dmd) - メーカー・企業と製品の一覧

Maskless exposure equipmentの製品一覧

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Maskless exposure device "ME-120F"

Supports up to 12-inch wafers! Direct drawing compatible with general-purpose CAD eliminates the costs and time associated with photomask production!

◆Solving the Challenges of Photolithography with Direct Drawing The maskless exposure device performs direct drawing on the workpiece using a DMD (Digital Micromirror Device). By eliminating the enormous costs and time required for photomask production, the challenges of traditional photolithography processes are resolved, making the prototyping of semiconductor devices more accessible. ◆Selectable Exposure Modes Since 2016, a fine exposure mode utilizing pixel interpolation technology has been standard. While the throughput time is longer compared to the standard exposure mode, the data reproducibility of diagonal lines and curved patterns is significantly improved. ◇What is DMD? DMD refers to hundreds of thousands of tiny mirrors arranged in a grid pattern. By illuminating these mirrors and controlling each one ON/OFF, image data created with general-purpose CAD is projected onto the workpiece. The light source uses LED light, which is long-lasting and economical.

  • Other semiconductor manufacturing equipment

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Maskless exposure device "MX Series"

Contributes to shortening development/delivery times and reducing costs in the exposure processes of semiconductor manufacturing.

In the exposure technology used in semiconductor manufacturing processes, micro-sensor (accelerometer, pressure sensor, temperature sensor, gas sensor) manufacturing processes, and printed circuit board manufacturing processes, the mainstream method involves using photomasks to transfer patterns onto substrates. On the other hand, the maskless exposure device "MX Series" employs a unique point array method using DMD (Digital Micromirror Device), allowing for direct exposure from CAD data. This exposure method, which does not use photomasks, achieves world-class exposure precision (below 1 micron). It facilitates easier prototyping and contributes to reductions in time and cost. 【Features】 ○ Expensive masks are no longer necessary ○ Prevention of external leakage of mask data ○ Reduced time from design of drawing patterns to actual drawing ○ Easy modification of drawing pattern designs ○ Correction of exposure patterns to match the distortion of each substrate is possible - For more details, please contact us or download the catalog.

  • Other semiconductor manufacturing equipment

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録